Polyimide-based no flow prepreg materials for high temperature printed circuit applications.These products consist of a flame resistant, polyimide‑resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties.
Polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA), which results in a polymer with a high Tg, without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.
- Greater thermal performance over competitive products with very high epoxy content
- Maintains bond strength at high temperature
- Durable resin system
- Improved processing due to less brittleness
- Less delamination from machining
- Meets all OSHA 1910.1050 requirements
- Halogen-free product offering
- RoHS Compliant
- UL – File Number E41625
- Military
- Aerospace
- Commercial
- Industrial
Polyimide PCB
- Product Code:Polyimide
- Availability:In Stock
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MYR750
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